Android Expansion Module

Android Expansion Module

Android Expansion Module

Elo expansion module menawarkan opsi untuk pemasangan baik di bagian belakang unit I-Series dengan VESA mount atau di bawah flip stand, untuk manajemen kabel yang lebih baik.

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Description

Spesifikasi

Nomor ProdukE809509
Warna EnclosureBlack
KompatibilitasI-Series 4Note: Expansion Module can only be used with the power brick included in the kit (I-Series power brick is not compatible).
I/O Ports12V (1.5A) Powered USB; 24V (2.3A) Powered USB; Serial COM Port (RJ45); 5V USB 2.0 (x2); 19V DC IN
Dimensi5.79" x 4.69" x 1.02" / 147 mm x 119 mm x 26 mm
Dimensi Box Pengiriman13.5" x 10.0" x 3.93" / 344 mm x 255 mm x 100 mm
Opsi Pemasangan100mm VESA mountAdditional mounting options with I-Series Flip Stand - Elo P/N: E924077 (see I-Series Flip Stand dimensional drawing MS601866 for more details)
Berat (Sebelum Dikemas)1.26 lbs / 0.57 kg
Berat (Sesudah Dikemas)4.00 lbs /1.81 kg
Suhu saat Beroperasi0°C to 40°C / 32°F to 104°F
Suhu Dalam Mode Penyimpanan-20°C to 60°C / -4°F to 140°F
KelembapanOperating: 20% to 80%; Storage: 10% to 95%
Persetujuan dan Pernyataan PeraturanCE (Europe) - Class A China RoHSThe following countries are certified with the I-Series: UL, FCC (US) - Class A cUL, IC (Canada) CB (International safety) VCCI (Japan) RCM (Australia)
MTBF50,000 hours demonstrated
Garansi2-year
Paket Sudah TermasukPower adapter Power cable (1.8 m) IEC 60320-C5 to NA plug Power cable (1.8 m) IEC 60320-C5 to EU/KR plug RJ45 to DB9 Serial CableSpecific for flip-stand (E924077): Qty.2 - M4 x 6 pan head Qty.2 – M4 X 28 flat head Qty.1 – M3 X 8 pan head Qty.3 – tie-wrap QIG PN E988926 Cable Bracket Qty.1 – M3x4 pan head
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Android Expansion Module